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A D V A N C E D M A T E R I A L S & P R O C E S S E S | S E P T E M B E R 2 0 1 6

2 8

Opening in 1968, the Fort Worth Convention Center is noted for its indoor arena, resembling

a flying saucer.

42

nd

INTERNATIONAL

SYMPOSIUM FOR TESTING

AND FAILURE ANALYSIS

NOVEMBER6–10

FORTWORTHCONVENTIONCENTER, TEXAS

T

he theme of ISTFA 2016 is

Next

Generation

, and it is truly infused

into all levels of the program.

here are opportunities to meet and

discuss research with students work-

ing on various failure analysis topics,

and to possibly find an engineer to fill

a future job opening. However, a

Next

Generation

engineer is rare—some even

think there is a crisis fueled by a lack of

relevant academic education. Christian

Boit and Philipp Scholz address this

in their keynote presentation, which

proves the opposite is true.

The technical program is poised to

be excellent, with papers coming from a

record number of abstract submissions.

For networking and relaxation, there is a

lively, Texas-inspired evening event. As

always, the exposition attracts top com-

panies in the industry to demonstrate

next-generationequipment andproducts.

More than 60 companies are showcased.

EDUCATIONSHORT

COURSES

SATURDAY, NOVEMBER5

Beam-Based Defect Localization

Instructor: Edward Cole, Jr.

Sandia National Laboratories

Fault Isolation Techniques for

Failure Analysis

Instructor: David Vallett

PeakSource Analytical LLC

Electrostatic Discharge in

Robotic Manufacturing Lines

Instructor: Peter Jacob

EMPA Duebendorf

MONDAY, NOVEMBER 7

Tools of the Trade Tour

5:00 – 6:00 p.m.

This tour allows select ISTFA

attendees exclusive access to attend

and view product demonstrations from

top companies prior to the exhibit hall

opening. Reception to follow.

Social event

7:00 – 10:00 p.m.

Enjoy a fun-filled evening at the

iconic “Billy Bob’s Texas” including

food, drinks, and entertainment. Every

full conference attendee receives a

ticket as part of registration.

TUESDAY, NOVEMBER8

Plenary session

9:00 – 10:30 a.m.

Christian Boit, professor at the

Technische Universität Berlin, former

director of failure analysis at Infineon

Technology, and general chair of ISTFA

2002 demonstrates, together with

Philipp Scholz, that it is possible for a

university to equip engineers with great

skills and knowledge. His students suc-

cessfully find internships and employ-

ment in failure analysis at tier one

semiconductor companies not only in

Europe, but also in the U.S.