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A D V A N C E D
M A T E R I A L S
&
P R O C E S S E S |
S E P T E M B E R
2 0 1 5
6 9
SURFACE ENGINEERING PRODUCTS& LITERATURE
Hitachi High-Technologies Corp., Ja-
pan, announces the NX9000 real-time
3D analytical FIB 1-SEM 2 compos-
ite instrument. Automatic repetition
of FIB cross-section preparation and
SEM observation provide a series of
cross-sectional images enabling 3D
structural analysis of a specified mi-
croscopic section. The SEM column
and FIB column are arranged orthog-
onally rather than the usual diagonal
configuration, which avoids issues that
affected conventional FIB-SEM com-
posite instruments, namely shrinking
of cross-sectional SEM images and non-
alignment of the visual field on recov-
ery of an image series.
LeicaMicrosystems, Germany, launched
the DM4 P polarization microscope
for the investigation of crystalline
structures such as minerals, plastics
and polymers, drugs and pharmaceu-
ticals, and pigments and cement. The
microscope is fully coded and semi-
automated and can be configured
with either a transmitted light axis or
an incident light axis (or both), which
makes it a useful tool for polarization
tasks. LED illumination lights samples
homogeneously and at a constant color
temperature at all microscope settings.
Physik Instrumente (PI), Germany,
introduces PInano, a super resolution
(SR) microscope stage series avail-
able in two variations including high
precision with piezoresistive position
feedback sensors and high precision
with high stability based on capaci-
tive feedback sensors. High stability
models are equipped with direct-mea-
suring capacitive sensors. The large
aperture accommodates microscopy
accessories, such as slide holders and
Petri dish holders. The recessed bottom
slide mount allows full rotation of the
turret, without in-and-out Z-motion.
.
Oxford Instruments, UK, launched
X-Max Extreme, a silicon drift detector
reported to be a breakthrough solution
for ultrahigh resolution FEG and FIB-
SEM applications. The EDS spatial reso-
lution using X-Max Extreme approaches
that of the SEM. The detector enables
EDS data collection at very low kV
(between 1-3 kV) and a very short work-
ing distance to provide elemental
analysis under the conditions used to
analyze nanomaterials and surfaces at
the highest SEM resolution. It is based
on a windowless 100 mm2 detector—
and uses a radical geometry to enable
data acquisition under short working
distances. .
Carl Zeiss, Germany, introduces ZEISS
Atlas 5, a hardware and software
package that extends the capacity of
ZEISS scanning electron microscopes
(SEMs) and focused ion beam SEMs.
Atlas 5 streamlines automatic image
acquisition and enables efficient navi-
gation and correlation of images from
any source including light and x-ray
microscopes. Taking full advantage of
high throughput and automated large
area imaging, users can acquire large
sets of 2D or 3D nanoscale electron
microscope images for hours, or even
days, without operator supervision.
Advanced preset and customizable pro-
tocols produce consistent and repro-
ducible results. .